The CHIPS and Science Act has moved from legislation on paper to money on the table. Passed in 2022, it earmarks tens of billions of dollars in subsidies and tax incentives to rebuild U.S. semiconductor manufacturing, advanced packaging, and upstream supply chains, alongside new support for emerging domains such as quantum computing.

CHIPS Act in brief: scale and goals

The CHIPS and Science Act authorized roughly $52.7 billion in federal support, including $39 billion in direct manufacturing incentives and additional tax credits for semiconductor equipment and facilities. As of late 2024, about $32.5 billion of that broader envelope had been allocated in some form, including large grants, loans, and announced incentives for future projects. The core aims are to increase domestic wafer capacity, support advanced packaging, secure supplies for critical sectors like automotive and defense, and catalyze private investment in leading-edge and specialty manufacturing.

Biggest manufacturing grant recipients so far

Public data through 2024 show that a relatively small group of companies captured the bulk of announced CHIPS manufacturing grants and related loans. Eight corporations alone account for more than half of the planned federal funding for semiconductor fabs and related facilities.

Intel

Intel is the single largest beneficiary of CHIPS Act manufacturing incentives to date. As of April 2024, it was slated to receive around $8.5–8.7 billion in federal grants, plus an additional estimated $11 billion in government loans to support a suite of U.S. projects. These awards back major expansions and new builds in Arizona, New Mexico, Ohio, and Oregon, covering both advanced logic nodes and advanced packaging capabilities. Intel has tied these incentives to an anticipated private investment commitment on the order of $100 billion over the coming decade.

TSMC

Taiwan Semiconductor Manufacturing Company (TSMC), the world’s largest dedicated foundry, is another top recipient. U.S. grants of about $6.6 billion support its Arizona complex, where three fabs are planned to produce leading-edge chips for U.S. customers. Those federal grants are paired with an estimated $65 billion in TSMC’s own investment commitments for the site. The project is central to U.S. efforts to bring sub‑5 nm production onshore at scale.

Samsung Electronics

Samsung Electronics has secured roughly $6.4 billion in CHIPS Act grants for its facility in Austin, Texas. The plant is slated to produce advanced chips in the 4 nm and 2 nm range, positioning Samsung as a key alternative advanced-node supplier within the United States. Federal support is linked to an anticipated private investment of about $45 billion.

Micron Technology

Micron, the only U.S.-based memory manufacturer, is another major winner. It is expected to receive approximately $6.1 billion in grants to underpin large-scale DRAM and NAND investments, including projects such as a major manufacturing site in Clay, New York. Micron has signaled plans to invest roughly $50 billion in U.S. memory capacity through 2030, with CHIPS funding helping de-risk those commitments.

GlobalFoundries

GlobalFoundries has received around $1.5 billion in CHIPS Act grant commitments for projects in New York and Vermont focused on mature-node and specialty manufacturing. These initiatives include optoelectronic and sensor devices, as well as capacity pitched at automotive and industrial customers. In return, GlobalFoundries anticipates roughly $12 billion in its own investments tied to these U.S. expansions.

Microchip Technology

Microchip Technology, a major supplier of microcontrollers and analog components, has been awarded about $162 million in grants. Although smaller than the headline awards to giants like Intel or TSMC, this funding supports critical mature-node capacity for embedded and industrial applications where continuity of supply is strategically important.

BAE Systems

BAE Systems, the defense and aerospace company, has also received CHIPS Act support. Public tallies list around $35 million in grants directed at specialized manufacturing used in defense-related electronics. The award size is modest relative to leading-edge fab projects but underscores the Act’s role in hardening supply chains for military and critical infrastructure systems.

Beyond fabs: upstream and ecosystem awards

Although headline coverage often focuses on wafer fabs, CHIPS Act disbursements extend into upstream materials and optics, as well as advanced packaging and test.

Corning, for instance, has received funding to expand production of specialized glass for lithography equipment and precision optical components used in semiconductor manufacturing. These materials are critical for high‑NA and advanced lithography systems, and domestic capacity reduces dependence on foreign supply.

Additional awards have gone to companies like Bosch, supporting a $225 million grant for a silicon carbide expansion in Roseville, California to serve automotive demand. Other ecosystem players, including Infinera and related optical networking firms, have secured support for advanced communications manufacturing.

New frontier: CHIPS funding for quantum manufacturing

By 2026, CHIPS Act incentives had broadened to include quantum computing manufacturing capacity, reflecting the program’s “Science” component. The U.S. Department of Commerce announced letters of intent totaling around $2.01 billion in incentives for quantum-related projects, split between foundry-like facilities and individual quantum hardware companies.

IBM and GlobalFoundries (quantum foundries)

IBM is slated to receive about $1 billion to establish a new quantum foundry subsidiary producing quantum-grade superconducting wafers. GlobalFoundries, in addition to its conventional CHIPS awards, is earmarked for roughly $375 million to build a secure domestic quantum foundry for leading architectures and multiple modalities. These awards aim to create dedicated manufacturing capacity for quantum chips and substrates within the U.S.

Quantum computing companies

Seven quantum computing firms have been selected for CHIPS Act awards, each focused on different technological modalities. Proposed incentives include up to roughly $100 million per company for:

- Atom Computing – neutral-atom quantum computing manufacturing challenges.

- Diraq – scaling silicon spin-based quantum logic units.

- D‑Wave – annealing and gate-model superconducting systems.

- Infleqtion – large-scale neutral-atom architectures.

- PsiQuantum – photonic quantum computing hardware.

- Quantinuum – trapped-ion fault-tolerant system scaling.

- Rigetti – next-generation superconducting quantum architectures.

For these seven companies, the Department of Commerce has indicated it will receive minority, non‑controlling equity stakes in return, adding a novel structure to CHIPS awards in the quantum domain.

How awards are distributed across states and projects

Geographically, early CHIPS disbursements have heavily favored Arizona, Texas, and New York, each attracting between roughly $5 and $10 billion in funding by late 2024. Arizona hosts TSMC’s large complex; Texas anchors Samsung’s and other fabs; and New York has major Micron and GlobalFoundries projects, alongside Bosch’s silicon carbide expansion.

Across all categories, the U.S. Government Accountability Office has reported CHIPS funding commitments to around 19 companies across roughly 40 projects, covering advanced logic and memory, mature and specialty nodes, advanced packaging, and critical upstream inputs. This mix reflects a strategy of both bolstering cutting-edge capabilities and shoring up supply for automotive, industrial, defense, and emerging quantum applications.

Who is still waiting for funds?

Despite the flurry of announcements, not all proposed projects have received full CHIPS awards. As of late 2024, nine announced projects with a combined requested funding of about $12.6 billion had yet to obtain final grants. Some companies are still moving through Commerce Department review, environmental permitting, and negotiation of exact incentive structures.

Additionally, smaller ecosystem players and regional fabs continue to apply for support aimed at automotive, industrial, and specialty components, suggesting that the list of recipients will expand as the program matures.

Strategic implications: winners, followers, and gaps

The current map of CHIPS Act disbursements reveals a few clear themes:

Concentration among a few giants. Intel, TSMC, Samsung, and Micron together account for the majority of announced manufacturing grants, underlining policymakers’ desire to anchor leading-edge logic and large memory capacity in the U.S.

Balanced support for mature nodes. GlobalFoundries, Microchip, Bosch and others show that mature-node, analog, power, and specialty devices are not ignored; they are treated as critical to automotive, industrial, and defense supply resilience.

Extension into upstream and quantum. Awards to Corning, Infinera, IBM, and quantum startups demonstrate that CHIPS funding is now shaping materials, photonics, and next-generation compute—not only traditional CMOS logic and memory.

Regional clustering. Funding clusters in key hubs (Arizona, Texas, New York, California, and select Northeast and Midwest sites) help build local ecosystems of fabs, OSATs, materials suppliers, and universities, but also raise questions about how evenly the benefits are spread.

Using the disbursement map as a guide

For investors, tracking which companies have secured CHIPS Act subsidies can inform expectations about capital intensity, risk-sharing, and potential returns on large U.S. projects. Companies with large grants and loans have de-risked parts of their capex plans but may also face heightened political and execution scrutiny.

For OEMs and procurement teams, knowing which domestic fabs and packaging houses are backed by CHIPS funding can guide long-term sourcing strategies, especially for automotive, industrial, and high‑end compute programs. Facilities with committed public support may be more likely to reach scale, but they may also be heavily booked by anchor customers.

For policymakers, the evolving list of recipients highlights where gaps remain: analog and RF ecosystems, some packaging tiers, and smaller specialty manufacturers still seek support. Future rounds of awards and follow‑on legislation will likely focus on filling these gaps while ensuring CHIPS investments translate into durable domestic capability rather than one‑off construction booms.

As of mid‑2026, the CHIPS Act has clearly identified early winners in advanced logic, memory, packaging, materials, and quantum—but the full set of beneficiaries and long‑term impacts will only become obvious as projects come online, yields stabilize, and global demand tests the resilience of this newly subsidized ecosystem.